Conference Topics

The conference has six major themes, and the following areas are of particular interest:

• MATERIALS

• PHYSICS

• DEVICES

• DEVICE TECHNOLOGY

• MICROSYSTEMS TECHNOLOGY, PRODUCTION AND MANUFACTURABILITY

• SYSTEMS INTEGRATION OF LOW DIMENSIONAL STRUCTURES AND DEVICES

MATERIALS

• Advances in materials growth technologies

• Atomically structured materials

• Semiconductors, magnetic semiconductors, organics, polymers, carbon nanotubes, superconductors, metals, insulators, hybrid structures, and other materials

• Photonic crystals

• Quantum wells, wires and dots

• Patterned and selective area growth

• In-situ processing and characterisation

• Production and manufacturability issues of epitaxial growth techniques

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PHYSICS

• Characterisation of low dimensional structures: scanning probe microscopy and electron spectroscopy

• Basic science and concepts of surfaces and interfaces

• Low dimensionality and nanostructures

• New device-related phenomena

• Heterostructures and superlattices: optical and transport

• Two, one and zero dimensional systems

• Spin related phenomena in low dimensional structures

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DEVICES

• Optoelectronic devices and applications

• Integrated optoelectronic devices

• Electronic devices and applications

• Nanoelectronics

• Magnetoelectronics – Spintronics

• High power, high temperature devices

• Nanodevices and molecular electronics

• High-speed devices technologies for future wireless, automotive and microwave applications

• New materials and new concepts

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DEVICE TECHNOLOGY

• Device technology

• Process integration

• Lithography for semiconductor manufacturing

• Nanolithography

• Advances in processing technologies

• Device passivation, encapsulation and packaging

• Low dimensional device architecture

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MICROSYSTEMSTECHNOLOGY, PRODUCTION AND MANUFACTURABILITY

• Micromachining and microfabrication process technology

• Micromachined devices and components

• Microelectronic structures and microcavities

• Material issues

• Device and system modelling

• Manufacturing issues

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SYSTEMS INTEGRATION OF LOW DIMENSIONAL STRUCTURES AND DEVICES

• MEMS, NMES and MOEMS fabrication

• Integration technologies:  modular and multifunctional systems

• Assembly technologies

• Microconnect issues

• Thermal  issues

• System modelling:  safety, reliability and intelligence

• Manufacturing issues

• Metrology for microsystems

• New concepts and perspectives

Conference Scope | Conference Topics | Conference Committees | Venue & Accommodation | Invited Speakers | 

Important Dates | Abstract Submission | Proceedings | Oral Presentation | Poster Presentation | Social Events |

 Registration Information | LDSD 2002 Photographs | Conference Secretariat